US 12,005,475 B2
Multi-layer curable compositions containing 1,1-di-activated vinyl compound products and related processes
Scott J. Moravek, Mars, PA (US); Daniel Connor, Evans City, PA (US); Adam B. Powell, Wexford, PA (US); Kurt G. Olson, Gibsonia, PA (US); Shanti Swarup, Allison Park, PA (US); Caroline S. Harris, Pittsburgh, PA (US); Davina J. Schwartzmiller, Rural Valley, PA (US); Aditya Gottumukkala, Monroeville, PA (US); John M. Furar, Pittsburgh, PA (US); William E. Eibon, Elyria, OH (US); Allison G. Condie, Valencia, PA (US); Richard J. Sadvary, Tarentum, PA (US); Scott W. Sisco, Glenshaw, PA (US); and Shiryn Tyebjee, Tarentum, PA (US)
Assigned to PPG Industries Ohio, Inc., Cleveland, OH (US)
Filed by PPG Industries Ohio, Inc., Cleveland, OH (US)
Filed on Jan. 3, 2023, as Appl. No. 18/149,445.
Application 18/149,445 is a continuation of application No. 17/197,680, filed on Mar. 10, 2021, granted, now 11,583,891.
Application 17/197,680 is a continuation of application No. 16/320,534, granted, now 10,987,697, issued on Apr. 27, 2021, previously published as PCT/US2017/044032, filed on Jul. 26, 2017.
Claims priority of provisional application 62/454,965, filed on Feb. 6, 2017.
Claims priority of provisional application 62/372,365, filed on Aug. 9, 2016.
Claims priority of provisional application 62/366,781, filed on Jul. 26, 2016.
Prior Publication US 2023/0201874 A1, Jun. 29, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B05D 7/00 (2006.01); C09D 4/00 (2006.01); B05D 3/02 (2006.01); C08K 5/17 (2006.01); C08L 35/02 (2006.01)
CPC B05D 7/572 (2013.01) [B05D 7/574 (2013.01); C09D 4/00 (2013.01); B05D 3/0254 (2013.01); B05D 7/534 (2013.01); B05D 7/542 (2013.01); B05D 2202/10 (2013.01); B05D 2401/20 (2013.01); B05D 2508/00 (2013.01); B05D 2518/00 (2013.01); C08K 5/17 (2013.01); C08L 35/02 (2013.01)] 20 Claims
 
1. A curable composition configured to be applied in direct contact with a layer comprising a first polymeric resin, the curable composition comprising:
a second polymeric resin; and
a crosslinking/curing agent for the second polymeric resin, wherein the crosslinking/curing agent comprises a polymerization reaction product of a methylene dicarbonyl compound, a multifunctional form thereof, or a combination of any thereof.