	US 12,005,155 B2
	High-modulus alloy for medical devices
James Davidson, San Juan Capistrano, CA (US); William Rezach, Covington, TN (US); and Rodney Ballard, Lakeland, TN (US)
Assigned to WARSAW ORTHOPEDIC, INC., Warsaw, IN (US)
Filed by Warsaw Orthopedic, Inc., Warsaw, IN (US)
Filed on Dec. 7, 2020, as Appl. No. 17/113,635.
Claims priority of provisional application 62/964,578, filed on Jan. 22, 2020.
Prior Publication US 2021/0220513 A1, Jul. 22, 2021
Int. Cl. A61L 31/02 (2006.01); A61L 27/04 (2006.01); A61L 27/50 (2006.01); A61L 31/14 (2006.01); C22C 27/00 (2006.01); C22C 27/04 (2006.01)

CPC A61L 27/047 (2013.01) [A61L 27/50 (2013.01); A61L 31/022 (2013.01); A61L 31/14 (2013.01); C22C 27/00 (2013.01); C22C 27/04 (2013.01); A61L 2430/12 (2013.01); A61L 2430/22 (2013.01); A61L 2430/38 (2013.01)]

35 Claims

1. A medical device comprising:

a biocompatible refractory-metal-based alloy, comprising multiple refractory metals;

wherein the alloy has an elastic modulus above about 300 GPa;

wherein the alloy comprises 30-35% tungsten and 60% molybdenum;

wherein the alloy further comprises 5-10% niobium; and

wherein the alloy is absent of rhenium.