US 12,004,720 B2
Packaged image sensor and endoscope
Chu-Ming Cheng, Hsinchu (TW); Shangyi Wu, Hsinchu (TW); Chia-Jung Lee, Hsinchu (TW); and Chih-Lu Hsu, Hsinchu (TW)
Assigned to MEDIMAGING INTEGRATED SOLUTION, INC., Hsinchu (TW)
Filed by Medimaging Integrated Solution, Inc., Hsinchu (TW)
Filed on Sep. 16, 2021, as Appl. No. 17/476,808.
Claims priority of application No. 110105869 (TW), filed on Feb. 19, 2021.
Prior Publication US 2022/0265132 A1, Aug. 25, 2022
Int. Cl. A61B 1/05 (2006.01); A61B 1/00 (2006.01); A61B 1/005 (2006.01); A61B 1/06 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/173 (2006.01); A61B 1/018 (2006.01)
CPC A61B 1/051 (2013.01) [A61B 1/0011 (2013.01); A61B 1/00124 (2013.01); A61B 1/0057 (2013.01); A61B 1/0676 (2013.01); H01L 27/14618 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01); H01L 31/173 (2013.01); A61B 1/018 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A packaged image sensor, comprising:
a substrate, including a first surface, a second surface opposite to the first surface, a through-hole, a plurality of first electric-conduction contacts, a plurality of second electric-conduction contacts, and a plurality of third electric-conduction contacts, wherein the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are disposed on the first surface, the plurality of first electric-conduction contacts are disposed on the second surface, and the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts;
an image sensor, disposed on the substrate and electrically connected with the plurality of second electric-conduction contacts;
a light-emitting element, disposed on the substrate and near the image sensor and electrically connected with the plurality of third electric-conduction contacts; and
a first encapsulant, filled into a space between the image sensor and the light-emitting element with the through-hole of the substrate kept opened;
wherein a pipe is disposed inside the through-hole of the substrate and protruding from the second surface of the substrate where the first electric-conduction contacts are disposed.