US 12,004,719 B2
Image sensor package and endoscope
Shangyi Wu, Hsinchu (TW); and Chu-Ming Cheng, Hsinchu (TW)
Assigned to MEDIMAGING INTEGRATED SOLUTION, INC., Hsinchu (TW)
Filed by Medimaging Integrated Solution, Inc., Hsinchu (TW)
Filed on Nov. 26, 2021, as Appl. No. 17/535,867.
Claims priority of application No. 110105871 (TW), filed on Feb. 19, 2021; and application No. 110127986 (TW), filed on Jul. 29, 2021.
Prior Publication US 2022/0265130 A1, Aug. 25, 2022
Int. Cl. H04N 5/335 (2011.01); A61B 1/05 (2006.01); G02B 23/24 (2006.01); H01L 27/146 (2006.01)
CPC A61B 1/05 (2013.01) [G02B 23/2415 (2013.01); G02B 23/2484 (2013.01); H01L 27/14636 (2013.01)] 40 Claims
OG exemplary drawing
 
1. An image sensor package, comprising:
a first substrate, including a plurality of first electric-conduction contacts, a plurality of second electric-conduction contacts, and a plurality of third electric-conduction contacts, wherein the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts;
an image sensor, disposed on the first substrate and electrically connected with the plurality of second electric-conduction contacts;
a second substrate, disposed on the first substrate and includes a plurality of fourth electric-conduction contacts, a plurality of fifth electric-conduction contacts, and an accommodating portion, wherein the plurality of fourth electric-conduction contacts is electrically connected with the plurality of corresponding third electric-conduction contacts, and the image sensor protrudes from the second substrate via the accommodating portion;
a light-emitting element, disposed on the second substrate and near the image sensor and electrically connected with the plurality of fifth electric-conduction contacts; and
a first encapsulant, filled into a space between the image sensor and the light-emitting element.