CPC A61B 1/05 (2013.01) [G02B 23/2415 (2013.01); G02B 23/2484 (2013.01); H01L 27/14636 (2013.01)] | 40 Claims |
1. An image sensor package, comprising:
a first substrate, including a plurality of first electric-conduction contacts, a plurality of second electric-conduction contacts, and a plurality of third electric-conduction contacts, wherein the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts;
an image sensor, disposed on the first substrate and electrically connected with the plurality of second electric-conduction contacts;
a second substrate, disposed on the first substrate and includes a plurality of fourth electric-conduction contacts, a plurality of fifth electric-conduction contacts, and an accommodating portion, wherein the plurality of fourth electric-conduction contacts is electrically connected with the plurality of corresponding third electric-conduction contacts, and the image sensor protrudes from the second substrate via the accommodating portion;
a light-emitting element, disposed on the second substrate and near the image sensor and electrically connected with the plurality of fifth electric-conduction contacts; and
a first encapsulant, filled into a space between the image sensor and the light-emitting element.
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