| CPC H10N 30/08 (2023.02) [B81B 3/0018 (2013.01); B81C 1/0015 (2013.01); H04R 3/005 (2013.01); H04R 7/10 (2013.01); H04R 17/02 (2013.01); H10N 30/302 (2023.02); H10N 30/306 (2023.02); H10N 30/87 (2023.02); B81B 2201/0257 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0307 (2013.01); B81B 2203/04 (2013.01); B81B 2207/01 (2013.01); H04R 2201/003 (2013.01)] | 18 Claims |

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1. A piezoelectric sensor, comprising:
a substrate;
a cantilever beam having a proximal portion attached to the substrate and extending to an unsupported distal end of the beam; and
an electrode disposed on or in the proximal portion of the beam, the electrode having an outer boundary with a shape substantially corresponding to a contour line of a strain distribution plot for the cantilever beam resulting from a force applied to the cantilever beam.
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7. A piezoelectric microelectromechanical systems microphone, comprising:
a substrate; and
a plurality of piezoelectric sensors movably coupled to the substrate, each of the piezoelectric sensors spaced apart from an adjacent piezoelectric sensor by a gap and including: a cantilever beam having a proximal portion attached to the substrate and extending to an unsupported distal end of the beam, and an electrode disposed on or in the proximal portion of the beam, the electrode having an outer boundary with a shape substantially corresponding to a contour line of a strain distribution plot for the cantilever beam resulting from a force applied to the cantilever beam, the plurality of piezoelectric sensors configured to deflect when subjected to sound pressure.
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