US 12,328,972 B2
Bonding method of micro-light emitting diode chip
Xiaobiao Dong, Kunshan (CN)
Assigned to Chengdu Vistar Optoelectronics Co., Ltd., Chengdu (CN)
Filed by Chengdu Vistar Optoelectronics Co., Ltd., Sichuan (CN)
Filed on Jul. 29, 2021, as Appl. No. 17/388,398.
Application 17/388,398 is a continuation of application No. PCT/CN2020/076481, filed on Feb. 24, 2020.
Claims priority of application No. 201910521185.3 (CN), filed on Jun. 17, 2019.
Prior Publication US 2021/0359154 A1, Nov. 18, 2021
Int. Cl. H10H 20/01 (2025.01); H10H 20/85 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/018 (2025.01) [H10H 20/8506 (2025.01); H10H 20/857 (2025.01); H10H 20/0364 (2025.01)] 16 Claims
OG exemplary drawing
 
1. A bonding method of a micro-light emitting diode chip, comprising:
providing a backplane comprising a plurality of chip bonding areas, and two solder columns are formed on electrodes of each of the chip bonding areas;
forming a glue groove in each of the chip bonding areas to locate the two solder columns in the glue groove;
forming a glue layer in the glue groove to make the glue layer cover tops of the solder columns, wherein a melting point of the glue layer is lower than a melting point of the glue groove and a height of the glue layer is higher than a height of the two solder columns when taking a side of the backplane facing the chip as a reference;
moving the chip to make a positive electrode and a negative electrode of the chip aligned with the two solder columns, respectively;
heating the backplane to make the glue layer melt into liquid glue;
moving the chip downward to make the positive electrode and the negative electrode of the chip immersed in the liquid glue;
cooling, to a room temperature, to solidify the liquid glue, and adhering the positive electrode and the negative electrode of the chip to the two solder columns, respectively; and
soldering the positive electrode and the solder column together, and soldering the negative electrode and the solder column together.