US 12,328,898 B2
High voltage semiconductor device including buried oxide layer
Sheng-Yao Huang, Kaohsiung (TW); Yu-Ruei Chen, New Taipei (TW); Zen-Jay Tsai, Tainan (TW); and Yu-Hsiang Lin, New Taipei (TW)
Assigned to UNITED MICROELECTRONICS CORP., Hsin-Chu (TW)
Filed by UNITED MICROELECTRONICS CORP., Hsin-Chu (TW)
Filed on Jun. 7, 2024, as Appl. No. 18/736,560.
Application 18/116,826 is a division of application No. 17/109,153, filed on Dec. 2, 2020, granted, now 11,626,515, issued on Apr. 11, 2023.
Application 18/736,560 is a continuation of application No. 18/116,826, filed on Mar. 2, 2023, granted, now 12,040,396.
Claims priority of application No. 202011177946.7 (CN), filed on Oct. 29, 2020.
Prior Publication US 2024/0322036 A1, Sep. 26, 2024
Int. Cl. H10D 30/65 (2025.01); H01L 21/265 (2006.01); H01L 21/28 (2025.01); H10D 30/01 (2025.01); H10D 30/60 (2025.01); H10D 62/10 (2025.01); H10D 64/01 (2025.01); H10D 64/27 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01)
CPC H10D 30/65 (2025.01) [H01L 21/26533 (2013.01); H01L 21/2822 (2013.01); H10D 30/0281 (2025.01); H10D 62/116 (2025.01); H01L 21/28211 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate;
a buried oxide layer in the substrate and near a surface of the substrate;
a gate dielectric layer on the substrate and covering the buried oxide layer;
a gate structure disposed on the gate dielectric layer and overlapping the buried oxide layer;
a source region and a drift region in the substrate and respectively at two sides of the gate structure, wherein the drift region partially covers a lower edge of the buried oxide layer and exposes a side edge of the buried oxide layer under the gate structure; and
a drain region in the drift region.