| CPC H10B 53/30 (2023.02) [H10D 1/692 (2025.01)] | 6 Claims |

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1. A method for manufacturing a two-terminal memory device, the method comprising:
forming an extended drain and a drain layer on a substrate;
forming a ferroelectric layer covering the substrate and the extended drain;
forming a semiconducting layer on the ferroelectric layer; and
forming a source layer connected to the semiconducting layer on the ferroelectric layer.
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