US 12,328,854 B2
Power converter
Mi Sun Lee, Seoul (KR); Sang Hun An, Seoul (KR); and Ji Hwan Jeon, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 18/019,005
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Aug. 2, 2021, PCT No. PCT/KR2021/010063
§ 371(c)(1), (2) Date Jan. 31, 2023,
PCT Pub. No. WO2022/025735, PCT Pub. Date Feb. 3, 2022.
Claims priority of application No. 10-2020-0096143 (KR), filed on Jul. 31, 2020.
Prior Publication US 2023/0247808 A1, Aug. 3, 2023
Int. Cl. H05K 7/20 (2006.01); H02M 7/00 (2006.01)
CPC H05K 7/20927 (2013.01) [H02M 7/003 (2013.01); H05K 7/20263 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A power converter comprising:
a housing which has an inner space part formed therein;
an electronic component being disposed in the space part, the electronic component being configured to generate heat due to an operation of the electronic component; and
a heat dissipating member including a first part being disposed on the electronic component and a second part being disposed on an inner surface of the housing,
wherein the heat dissipating member comprises:
a frame;
a heat dissipating pipe being disposed on one surface of the frame; and
a thermal pad being disposed between the heat dissipating pipe and the electronic component or between the heat dissipating pipe and the inner surface of the housing,
wherein the heat dissipating pipe has a region bent at least once,
wherein the frame includes:
a first plate portion being disposed on the electronic component; and
a second plate portion facing the inner surface of the housing,
wherein the first plate portion and the second plate portion are disposed perpendicular to each other,
wherein the heat dissipating pipe includes:
a first region being disposed on a lower surface of the first plate portion; and
a second region being disposed on an outer surface of the second plate portion,
wherein the first region and the second region are disposed perpendicular to each other,
wherein the thermal pad includes:
a first thermal pad being disposed between the first region and an upper surface of the electronic component; and
a second thermal pad being disposed between the second region and the inner surface of the housing,
wherein the first plate portion includes a first screw hole,
wherein the first thermal pad includes a second screw hole facing the first screw hole, and
wherein the heat dissipating member is screw-coupled to the electronic component through a screw penetrating the first screw hole and the second screw hole.