US 12,328,853 B2
Power supply device and printed circuit board device comprising same
Tai Ma, Beijing (CN); and Chao Wen, Beijing (CN)
Assigned to Telefonaktiebolaget LM Ericsson (Publ), Stockholm (SE)
Appl. No. 17/056,067
Filed by Telefonaktiebolaget LM Ericsson (publ), Stockholm (SE)
PCT Filed May 18, 2018, PCT No. PCT/CN2018/087486
§ 371(c)(1), (2) Date Jul. 2, 2021,
PCT Pub. No. WO2019/218344, PCT Pub. Date Nov. 21, 2019.
Prior Publication US 2021/0321527 A1, Oct. 14, 2021
Int. Cl. H05K 7/20 (2006.01); H02M 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 7/209 (2013.01) [H02M 3/003 (2021.05); H05K 1/0209 (2013.01); H05K 1/181 (2013.01); H05K 7/2039 (2013.01); H05K 2201/1003 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A power supply device mounted on a mainboard, the mainboard comprising a first surface, the power supply device comprising:
a magnetic device located above the first surface of the mainboard and electrically connected to the mainboard;
at least one accommodating portion located on a surface of the magnetic device facing towards the first surface, each of the at least one accommodating portion of the power supply device being a cavity which is recessed inwardly from the surface of the magnetic device facing towards the first surface of the mainboard;
a semiconductor device which is at least partially accommodated in the at least one accommodating portion and electrically connected to the mainboard; and
a first thermally conductive portion located in the at least one accommodating portion, and the semiconductor device is thermally coupled with the magnetic device by the first thermally conductive portion.