US 12,328,847 B2
Circuit card assemblies
Joo-Han Kim, Huntsville, AL (US); Brian Hoden, Albuquerque, NM (US); and Lucius Akalanne, Chippenham (GB)
Assigned to AMETEK, INC., Berwyn, PA (US)
Filed by AMETEK, INC., Berwyn, PA (US)
Filed on Oct. 31, 2022, as Appl. No. 17/977,617.
Claims priority of provisional application 63/274,557, filed on Nov. 2, 2021.
Prior Publication US 2023/0134978 A1, May 4, 2023
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01)
CPC H05K 7/205 (2013.01) [H05K 1/0204 (2013.01); H05K 7/1418 (2013.01); H05K 7/20281 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A thermal management system for a heat source comprising at least one electronic component, the thermal management system comprising:
one or more phase change modules comprising phase change material for distributing and storing heat;
a metal frame in thermal contact with the at least one electronic component and having at least one opening for receiving the one or more phase change modules; and
a heat transfer apparatus in thermal contact with one or more of the at least one electronic component and the metal frame, the heat transfer apparatus providing a first heat transfer path;
wherein the one or more phase change modules is configured for distributing and storing heat during a period of reduced heat dissipation or cooling; and
wherein the first heat transfer path is provided during the period of reduced heat dissipation or cooling and the first heat transfer path is different from a second heat transfer path during a period of standard steady-state heat dissipation or cooling.