US 12,328,846 B2
Elastic heat conduction mechanism for electronic devices
Hsiu-Ling Yu, Taoyuan (TW); Milo Li, Taoyuan (TW); and Hsuan-Chan Chiang, Taoyuan (TW)
Assigned to ADLINK TECHNOLOGY INC., Taoyuan (TW)
Filed by ADLINK TECHNOLOGY INC., Taoyuan (TW)
Filed on Feb. 24, 2023, as Appl. No. 18/174,459.
Prior Publication US 2024/0292570 A1, Aug. 29, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20454 (2013.01) [H05K 7/20418 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An elastic heat conduction mechanism for electronic devices, comprising:
a heat-conducting unit, said heat-conducting unit comprising a base, an accommodating space defined on one side of said base to accommodate a preset heating element, a heat conduction space defined on an opposite side of said base opposite to said accommodating space, at least one heat-conducting assembly assembled in said heat conduction space and at least one pair of opposite wedge seats arranged inside said heat conduction space, each said heat-conducting assembly comprising two relative fixed seats assembled on two opposite outer sides of said wedge seats, two opposite wedges movably erected between said fixed seats, a plurality of lifting adjustment members respectively arranged at two sides of said wedges and respectively affixed to said fixed seats for said wedges to be respectively attached to said wedge seats in a floating manner and at least one elastic member set between said wedges to isolate relative inner side of said wedges to form an adjustment space; and
a heat-exchanging member, said heat-exchanging member comprising a storage space defined on one side thereof where said heat-conducting unit is assembled.