US 12,328,839 B2
Modular rear panel system for chassis of electronic device
Minh H. Nguyen, Fort Collins, CO (US); Earl W. Moore, Tomball, TX (US); and Keith Allen Sauer, Spring, TX (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Apr. 28, 2023, as Appl. No. 18/309,207.
Prior Publication US 2024/0365499 A1, Oct. 31, 2024
Int. Cl. H05K 7/14 (2006.01); H05K 5/02 (2006.01); H05K 7/18 (2006.01)
CPC H05K 7/1489 (2013.01) [H05K 5/0217 (2013.01); H05K 7/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A modular rear panel system for a chassis of an electronic device, comprising:
a plurality of modular brackets, each configured to be selectively coupled to the chassis at a corresponding bracket mounting location of a plurality of bracket mounting locations; and
a plurality of modular rear panel sections, each configured to be selectively coupled to one or more corresponding modular brackets of the plurality of modular brackets;
wherein the plurality of modular brackets and the plurality of modular rear panel sections comprise a plurality of combinations, each comprising a subset of the modular rear panel sections and a subset of the modular brackets that can be assembled together to form a rear panel of the chassis with the subset of the modular brackets coupled to the plurality of mounting locations and the subset of the modular rear panel sections coupled to the subset of the modular brackets,
wherein the rear panels formable from the plurality of combinations have mutually different rear panel configurations.