US 12,328,828 B2
Method for manufacturing circuit board
Chun-Hung Kuo, Taoyuan (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Jun. 30, 2022, as Appl. No. 17/810,340.
Claims priority of application No. 111117726 (TW), filed on May 11, 2022.
Prior Publication US 2023/0371189 A1, Nov. 16, 2023
Int. Cl. H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01)
CPC H05K 3/4644 (2013.01) [H05K 3/0041 (2013.01); H05K 3/062 (2013.01); H05K 2203/0554 (2013.01); H05K 2203/095 (2013.01); Y10T 29/49124 (2015.01)] 11 Claims
OG exemplary drawing
 
1. A method for manufacturing a circuit board, comprising:
providing a composite material film, wherein the composite material film comprises a metal film and a polymeric film;
disposing a dielectric layer on the polymeric film to form a stacked structure;
forming a first circuit layer on a substrate, wherein the first circuit layer comprises at least one contact pad;
bonding the stacked structure onto the substrate and the first circuit layer, such that the dielectric layer directly contacts the substrate and entirely covers the first circuit layer;
forming a first opening extending through and in the metal film to form a patterned metal film;
plasma etching the dielectric layer with the patterned metal film as a mask to form a second opening in the dielectric layer, wherein the at least one contact pad is exposed in the second opening;
removing the composite material film; and
depositing a conductive material in the second opening to form a conductive blind hole electrically connected to the at least one contact pad.