US 12,328,826 B2
Solder pads with concave edges for ball grid arrays
Edwin L Bradley, Chicago, IL (US); Anthony J Suppelsa, Chicago, IL (US); and David J Meyer, Chicago, IL (US)
Assigned to MOTOROLA SOLUTIONS, INC., Chicago, IL (US)
Filed by MOTOROLA SOLUTIONS, INC., Chicago, IL (US)
Filed on Jan. 7, 2022, as Appl. No. 17/571,092.
Prior Publication US 2023/0225060 A1, Jul. 13, 2023
Int. Cl. H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01)
CPC H05K 3/3436 (2013.01) [H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H05K 1/111 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10734 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a substrate including dielectric material;
a conductive via extending into the substrate from a surface of the substrate; and
a conductive pad positioned at the surface of the substrate and offset in a plane of the surface from the conductive via, the conductive pad to receive a solder joint connection to an electronic component;
wherein the conductive pad includes a circularly concave edge that defines a gap with a circularly convex edge of the conductive via,
wherein the circularly concave edge of the conductive pad and the circularly convex edge of the conductive via comprise respective circular segments that share a same circular center, wherein the circularly concave edge of the conductive pad and the circularly convex edge of the conductive via include complementary circular curvature that provide the gap with a constant width along an entirety of the circularly concave edge.