US 12,328,824 B2
Method and device for disassembling electronics
Tero Rinne, Vaasa (FI)
Assigned to 3R-Cycle Oy, Hyvinkää (FI)
Appl. No. 17/634,001
Filed by 3R-Cycle Oy, Hyvinkää (FI)
PCT Filed Aug. 7, 2020, PCT No. PCT/FI2020/050523
§ 371(c)(1), (2) Date Feb. 9, 2022,
PCT Pub. No. WO2021/028618, PCT Pub. Date Feb. 18, 2021.
Claims priority of application No. 20195670 (FI), filed on Aug. 12, 2019.
Prior Publication US 2022/0322592 A1, Oct. 6, 2022
Int. Cl. H05K 13/04 (2006.01); B09B 3/35 (2022.01); B09B 101/17 (2022.01)
CPC H05K 13/0486 (2013.01) [B09B 3/35 (2022.01); B09B 2101/17 (2022.01); Y10T 29/53274 (2015.01)] 27 Claims
OG exemplary drawing
 
1. A device for disassembling electronics, the device comprising:
transporting means, or holding means arranged to receive one or more objects comprising a circuit board containing one or more electronic components, the holding means being adjustable,
imaging means for imaging the one or more objects;
one or more removal means for removing the one or more electronic components from the circuit board,
one or more recovery means for recovering the removed one or more electronic components,
each of the transporting, imaging, one or more removal, and one or more recovery means being operatively connected to a control unit, wherein the device is arranged
to create a 3D model of the one or more objects based on the information, obtained from the imaging means,
to locate the one or more electronic components from the 3D model,
to adjust the holding means to adapt to the one or more objects and hold the one or more objects,
by using the 3D model to control the one or more removal means to remove the one or more electronic components from the circuit board by:
first removing a certain type of the one or more electronic components,
recovering the removed certain type of the one or more electronic components by using the one or more recovery means, wherein the one or more recovery means are configured to use vacuum or pressurized air, or by using the one or more holding means to adjust an angle of the circuit board to move the removed certain type of the one or more electronic components by gravity into collecting means provided below the one or more objects,
conveying the removed certain type of the recovered one or more electronic components to a desired location, and
then continuing with removing a different type of the one or more electronic components.