| CPC H05K 1/181 (2013.01) [H05K 1/115 (2013.01)] | 23 Claims |
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1. A printed circuit board, comprising:
a substrate structure including a first insulating material, a plurality of first wiring layers disposed on or in the first insulating material, and a plurality of first via layers disposed in the first insulating material; and
an interconnect structure including a second insulating material, a plurality of second wiring layers disposed on or in the second insulating material, and one or more second via layers disposed in the second insulating material,
wherein an upper surface of the second insulating material is exposed from an upper surface of the first insulating material, and at least a portion of each of a lower surface and a side surface of the second insulating material is covered with the first insulating material,
wherein the interconnect structure is disposed on an upper side of the substrate structure,
wherein the interconnect structure includes first and second connection regions, and
wherein the first and second connection regions are spaced apart from each other.
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