US 12,328,817 B2
Flexible printed circuit board, COF module, and electronic device comprising the same
Eon Jong Lee, Seoul (KR); Dong Chan Kim, Seoul (KR); and Ki Tae Park, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Jun. 28, 2023, as Appl. No. 18/215,469.
Application 18/215,469 is a continuation of application No. 17/504,611, filed on Oct. 19, 2021, granted, now 11,758,659.
Claims priority of application No. 10-2020-0140186 (KR), filed on Oct. 27, 2020.
Prior Publication US 2023/0345635 A1, Oct. 26, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/118 (2013.01) [H05K 1/028 (2013.01); H05K 1/111 (2013.01); H05K 1/189 (2013.01); H05K 2201/10136 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A flexible printed circuit board comprising:
a substrate; and
a circuit pattern disposed on the substrate,
wherein the substrate includes a chip mounting region, and
wherein the circuit pattern includes:
a first circuit pattern including a first-first pad portion disposed inside the chip mounting region of the substrate, a first-second pad portion disposed outside the chip mounting region of the substrate, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and the first wiring portion extending in a first direction;
a second circuit pattern including a second-first pad portion disposed inside the chip mounting region of the substrate, a second-second pad portion disposed outside the chip mounting region of the substrate, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and the second wiring portion extending in a second direction opposite to the first direction; and
a third circuit pattern including a plurality of third pad portions disposed inside the chip mounting region of the substrate, and a third wiring portion connecting the plurality of third pad portions inside the chip mounting region of the substrate,
wherein the plurality of third pad portions include a third-first pad portion and a third-second pad portion spaced apart from each other inside the chip mounting region of the substrate, and
wherein third wiring portion connects between the third-first pad portion and the third-second pad portion inside of the chip mounting region of the substrate.