| CPC H05K 1/11 (2013.01) [H05K 2201/09381 (2013.01)] | 20 Claims |

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1. A circuit board, comprising:
a first pad comprising a first body and a first mesh structure directly connected to the first body;
a second pad comprising a second body and a second mesh structure, the second mesh structure being directly connected to the second body, spaced from the first mesh structure in a first direction, and disposed between the first mesh structure and the second body in the first direction; and
a soldering element disposed on the first pad and the second pad, partially disposed between the first mesh structure and the second mesh structure, and electrically connecting the first pad to the second pad,
wherein a width of the first body in the first direction is greater than a width of the first mesh structure in the first direction, and a width of the second body in the first direction is greater than a width of the second mesh structure in the first direction.
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