US 12,328,814 B2
Printed wiring board and method for manufacturing printed wiring board
Keiichiro Yamamoto, Higashiosaka (JP); Kazuo Tani, Higashiosaka (JP); and Masaharu Yano, Higashiosaka (JP)
Assigned to TANAZAWA HAKKOSHA CO., LTD., Higashiosaka (JP)
Filed by TANAZAWA HAKKOSHA CO., LTD., Higashiosaka (JP)
Filed on Mar. 8, 2024, as Appl. No. 18/600,437.
Application 18/600,437 is a division of application No. 17/772,453, granted, now 11,979,982, previously published as PCT/JP2020/040252, filed on Oct. 27, 2020.
Claims priority of application No. 2019-197471 (JP), filed on Oct. 30, 2019.
Prior Publication US 2024/0244744 A1, Jul. 18, 2024
Int. Cl. H05K 1/02 (2006.01); B29C 70/30 (2006.01); B32B 5/10 (2006.01); B32B 5/12 (2006.01); B32B 5/26 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01)
CPC H05K 1/038 (2013.01) [H05K 1/036 (2013.01); H05K 3/0058 (2013.01); H05K 2201/029 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A printed wiring board comprising a sheet material including a cloth-like material woven of reinforced fiber, wherein
the cloth-like material is woven at an angle between a warp thread and a weft thread of the reinforced fiber of the sheet material being 90 degrees,
in the sheet material, threads configuring the cloth-like material are cut so that one side of a circumferential edge portion of the sheet material is tilted either one of leftward and rightward at an angle equal to or larger than 5 degrees and equal to or smaller than 30 degrees and a length of a cut portion obtained by cutting out the cloth-like-material configuration threads aligned on a cutting blade with the cutting blade is longer by 0.3 mm to 6.3 mm than a total length of a clearance between an upper blade and a lower blade configuring the cutting blade for cutting the cloth-like material and a thickness of the cloth-like-material configuration threads aligned on the cutting blade, and
the sheet material configures an inner-layer board or an insulating board, a metal layer is formed on a surface of the sheet material, and a conductor pattern is formed to the metal layer.