US 12,328,812 B2
Connector and printed circuit board with surface ground plane
Peerouz Amleshi, Lisle, IL (US); Pu Xie, Naperville, IL (US); David L. Brunker, Naperville, IL (US); Timothy R. McClelland, Bolingbrook, IL (US); and Teng-Kai Chen, San Jose, CA (US)
Assigned to Molex, LLC, Lisle, IL (US)
Appl. No. 17/277,308
Filed by Molex, LLC, Lisle, IL (US)
PCT Filed Sep. 25, 2019, PCT No. PCT/US2019/052811
§ 371(c)(1), (2) Date Mar. 18, 2021,
PCT Pub. No. WO2020/068887, PCT Pub. Date Apr. 2, 2020.
Claims priority of provisional application 62/736,288, filed on Sep. 25, 2018.
Prior Publication US 2022/0039250 A1, Feb. 3, 2022
Int. Cl. H05K 1/02 (2006.01); H01R 12/58 (2011.01); H01R 13/6587 (2011.01); H01R 13/6594 (2011.01); H05K 1/11 (2006.01)
CPC H05K 1/0225 (2013.01) [H01R 13/6587 (2013.01); H01R 13/6594 (2013.01); H05K 1/113 (2013.01); H01R 12/58 (2013.01)] 20 Claims
OG exemplary drawing
 
10. A printed circuit board and connector assembly comprising:
a printed circuit board comprising:
a top surface comprising a plurality of signal mounting positions, a plurality of ground mounting positions, anti-pads around the plurality of signal mounting positions, and a mounting region with an outer boundary formed between outermost signal mounting positions; and
a ground plane covering the top surface of the printed circuit board within the mounting region except for an active port region of the printed circuit board within the mounting region, the active port region comprising vias and the anti-pads within the mounting region, wherein a surface area of the ground plane covers at least 50% of a total surface area within the mounting region except the active port region; and
a connector comprising:
a plurality of wafers comprising a mounting face and an underside surface, the mounting face configured for mounting on the top surface of the printed circuit board, the underside surface comprising at least one conductive surface for a ground, the connector being configured for mounting on the printed circuit board such that an aperture between the at least one conductive surface and the ground plane of the printed circuit board is less than 0.3 mm,
wherein the plurality of wafers comprise signaling wafers, the signaling wafers configured to support a plurality of signal terminals, and each of the plurality of signal terminals comprises a tail portion, a contact portion and a body portion extending between the contact portion and the tail portion.