US 12,328,811 B2
Insulating member arrangement structure and electronic device including the same
Wooram Ki, Gyeonggi-do (KR); Dongcheol Park, Gyeonggi-do (KR); Yonghun Ji, Gyeonggi-do (KR); and Yongsang Yun, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd, Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Mar. 31, 2022, as Appl. No. 17/709,920.
Application 17/709,920 is a continuation of application No. PCT/KR2022/003439, filed on Mar. 11, 2022.
Claims priority of application No. 10-2021-0098746 (KR), filed on Jul. 27, 2021; and application No. 10-2021-0128844 (KR), filed on Sep. 29, 2021.
Prior Publication US 2023/0034551 A1, Feb. 2, 2023
Int. Cl. H05K 1/18 (2006.01); H04M 1/02 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0218 (2013.01) [H04M 1/0277 (2013.01); H05K 1/05 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 2201/0929 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a housing including a first surface, a second surface parallel to the first surface, and a side surface surrounding a space formed between the first surface and the second surface;
a first printed circuit board (PCB) disposed on the first surface of the housing;
a second PCB disposed on the first surface of the housing and spaced apart from the first PCB;
a flexible printed circuit board (FPCB) connecting the first PCB and the second PCB;
a conductive sheet disposed on the second surface of the housing and spaced apart from the first PCB, the second PCB, and the FPCB; and
an insulating member disposed on one surface of the FPCB and contacting the conductive sheet.