US 12,328,562 B2
Anchor silicon dioxide layer for piezoelectric microelectromechanical system microphone
Siarhei Dmitrievich Barsukou, Takarazuka (JP); Hiroyuki Nakamura, Osaka-Fu (JP); Keiichi Maki, Suita (JP); Takanori Yasuda, Nara (JP); and Ousmane I Barry, Settsu (JP)
Assigned to SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Oct. 4, 2022, as Appl. No. 17/937,830.
Claims priority of provisional application 63/252,831, filed on Oct. 6, 2021.
Prior Publication US 2023/0104257 A1, Apr. 6, 2023
Int. Cl. H04R 7/18 (2006.01); H04R 7/08 (2006.01)
CPC H04R 7/18 (2013.01) [H04R 7/08 (2013.01); H04R 2201/003 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A piezoelectric microelectromechanical system microphone comprising:
a support substrate;
a membrane including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the membrane; and
a compliant anchor including a trench defined in the support substrate about a portion of a perimeter of the membrane to increase sensitivity of the piezoelectric microelectromechanical system microphone.