| CPC H03L 1/00 (2013.01) [H03K 3/011 (2013.01); H03K 3/0315 (2013.01); H03K 3/0322 (2013.01); H03K 19/018528 (2013.01); H03L 7/00 (2013.01)] | 20 Claims |

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1. A first integrated circuit (IC) die comprising:
a hardware interface comprising conductive contacts to couple the first IC die to a second IC die;
first transmit driver circuits to communicate with the second IC die via the hardware interface;
first delay circuits coupled to the hardware interface to be coupled with second delay circuits of the second IC die to form a shared oscillator circuit that includes the first and second delay circuits; and
calibration circuitry coupled to the first transmit driver circuits and to the first delay circuits to:
identify a shared oscillator setting that enables the shared oscillator circuit to satisfy a reference frequency test condition, and
provide a driver setting, based on the shared oscillator setting, to the first transmit driver circuits.
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