US 12,328,110 B2
Microelectromechanical system resonator assembly
Ville Saarela, Espoo (FI); Antti Jaakkola, Espoo (FI); and Aarne Oja, Espoo (FI)
Assigned to KYOCERA TECHNOLOGIES OY, Espoo (FI)
Appl. No. 17/918,389
Filed by KYOCERA TECHNOLOGIES OY, Espoo (FI)
PCT Filed Mar. 30, 2021, PCT No. PCT/FI2021/050229
§ 371(c)(1), (2) Date Oct. 12, 2022,
PCT Pub. No. WO2021/209682, PCT Pub. Date Oct. 21, 2021.
Claims priority of application No. 20205386 (FI), filed on Apr. 15, 2020.
Prior Publication US 2023/0133733 A1, May 4, 2023
Int. Cl. H03H 9/24 (2006.01); H03H 9/02 (2006.01)
CPC H03H 9/2447 (2013.01) [H03H 9/02244 (2013.01); H03H 2009/02291 (2013.01); H03H 2009/0244 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A silicon microelectromechanical system, MEMS, resonator assembly, comprising:
four flexural beam elements forming a rectangular frame, each beam element being connected at an end thereof to an end of a neighboring one of the beam elements, the resonator assembly further comprising:
connection elements for connecting the rectangular frame to at least one mechanical anchor, and the resonator assembly supporting an in-plane flexural collective resonance mode, and
a meander spring element connecting a respective flexural beam element to its respective mass element.