US 12,328,101 B2
Amplification device and matching circuit board
Tadashi Minami, Yokohama (JP)
Assigned to Sumitomo Electric Device Innovations, Inc., Yokohama (JP)
Appl. No. 17/614,952
Filed by Sumitomo Electric Device Innovations, Inc., Yokohama (JP)
PCT Filed Mar. 30, 2021, PCT No. PCT/JP2021/013568
§ 371(c)(1), (2) Date Nov. 29, 2021,
PCT Pub. No. WO2021/200963, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 2020-060465 (JP), filed on Mar. 30, 2020.
Prior Publication US 2022/0239260 A1, Jul. 28, 2022
Int. Cl. H03F 1/02 (2006.01); H03F 1/08 (2006.01); H03F 3/193 (2006.01); H03F 3/21 (2006.01)
CPC H03F 1/086 (2013.01) [H03F 3/193 (2013.01); H03F 3/21 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An amplification device comprising:
a base substrate;
an amplification element mounted on the base substrate; and
a matching circuit board mounted on the base substrate and including a circuit pattern electrically connected to the amplification element,
wherein the matching circuit board includes a first side surface and a second side surface each extending in a longitudinal direction of the matching circuit board,
wherein the matching circuit board further includes a resistance pattern,
wherein a first recess is provided in the first side surface, and a second recess facing the first recess is provided in the second side surface,
wherein the first recess and the second recess are positioned to oppose each other in a direction orthogonal to the longitudinal direction,
wherein the circuit pattern is located between the first recess and the second recess, and
wherein the resistance pattern is not located between the first recess and the second recess.