| CPC H03B 5/124 (2013.01) [H03B 5/24 (2013.01); H03B 5/366 (2013.01)] | 17 Claims |

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1. A semiconductor die comprising:
a first pin configured to receive a non-inverted component of a differential input clock signal from an oscillator external to the semiconductor die;
a second pin configured to receive an inverted component of the differential input clock signal;
an oscillator interface circuit comprising a first controllable resistor and a first controllable capacitor connected in series between the first pin and the second pin, and a second controllable resistor and a second controllable capacitor connected in series between the second pin and the first pin, wherein the first controllable resistor connects to the first controllable capacitor at a first node, and the second controllable resistor connects to the second controllable capacitor at a second node; and
a clock processing circuit having a non-inverted in-phase (I) input connected to the first pin, a non-inverted quadrature-phase (Q) input connected to the first node, an inverted Q input connected to the second node, and an inverted I input connected to the second pin, the clock processing circuit comprising a first single-ended to differential conversion circuit configured to convert a single-ended I signal from one of the first pin or the second pin to a differential I clock signal, and a second single-ended to differential conversion circuit configured to convert a single-ended Q signal from one of the first node or the second node to a differential Q clock signal.
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