US 12,327,980 B2
Semiconductor laser driving apparatus, electronic equipment, and manufacturing method of semiconductor laser driving apparatus
Motoi Kimura, Kanagawa (JP); Hirohisa Yasukawa, Kanagawa (JP); Nobuaki Kaji, Kanagawa (JP); and Takashi Kobayashi, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/631,977
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jul. 2, 2020, PCT No. PCT/JP2020/025989
§ 371(c)(1), (2) Date Feb. 1, 2022,
PCT Pub. No. WO2021/033439, PCT Pub. Date Feb. 25, 2021.
Claims priority of application No. 2019-150229 (JP), filed on Aug. 20, 2019.
Prior Publication US 2022/0285909 A1, Sep. 8, 2022
Int. Cl. H01S 3/00 (2006.01); H01S 5/023 (2021.01); H01S 5/02345 (2021.01); H01S 5/0239 (2021.01); H01S 5/042 (2006.01); H01S 5/062 (2006.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01); H01S 5/02 (2006.01); H01S 5/0234 (2021.01)
CPC H01S 5/042 (2013.01) [H01S 5/023 (2021.01); H01S 5/02345 (2021.01); H01S 5/0239 (2021.01); H01S 5/06226 (2013.01); H01S 5/18305 (2013.01); H01S 5/423 (2013.01); H01S 5/0208 (2013.01); H01S 5/0234 (2021.01); H01S 5/0428 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor laser driving apparatus, comprising:
a substrate incorporating a laser driver;
a semiconductor laser that has at least one light emitting point and that is mounted on one surface of the substrate in such a manner that an electrode of the light emitting point and a pattern of the substrate are connected to each other via a bump; and
connection wiring that electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less,
wherein the connection wiring is provided between the laser driver and the semiconductor laser such that a length of the connection wiring is contained between a bottom portion of the semiconductor laser and a top portion of the laser driver.