US 12,327,979 B2
Optical semiconductor module
Naoki Itabashi, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Filed on Nov. 8, 2021, as Appl. No. 17/521,660.
Claims priority of application No. 2020-186793 (JP), filed on Nov. 9, 2020.
Prior Publication US 2022/0149592 A1, May 12, 2022
Int. Cl. H01S 5/042 (2006.01); H01S 5/022 (2021.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/068 (2006.01)
CPC H01S 5/042 (2013.01) [H01S 5/022 (2013.01); H01S 5/02415 (2013.01); H01S 5/026 (2013.01); H01S 5/068 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An optical semiconductor module comprising:
a board including a transmission line, the transmission line including a high-frequency wiring extending in a first direction and a ground wiring running in parallel with the high-frequency wiring, the high-frequency wiring having a constant distance from the ground wiring;
a block including a low-permittivity material;
an inductor mounted on the block, the inductor being connected with the high-frequency wiring via a first wire, the first wire having a first inductance;
a semiconductor laser device mounted on the board, the semiconductor laser device being connected with the high-frequency wiring via a second wire, the second wire having a second inductance smaller than the first inductance; and
a housing configured to accommodate the board, the block, the inductor, and the semiconductor laser device.