| CPC H01R 13/631 (2013.01) [H01R 13/5219 (2013.01); H01R 25/006 (2013.01); H01R 2201/26 (2013.01)] | 18 Claims |

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1. A header apparatus, comprising:
a housing comprising a compression limiter;
a cutting fastener coupled with a portion of the compression limiter;
an over-molded conductive material configured to couple with the housing between a top surface and a bottom surface of the housing to form a conductive path between the compression limiter and the cutting fastener;
a grounding shield coupled with the housing; and
the grounding shield includes a protrusion configured to contact the over-molded conductive material.
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