US 12,327,948 B2
High density coupling panel
Paul John Pepe, Clemmons, NC (US)
Assigned to CommScope Technologies LLC, Claremont, NC (US)
Appl. No. 17/765,107
Filed by COMMSCOPE TECHNOLOGIES LLC, Hickory, NC (US)
PCT Filed Sep. 29, 2020, PCT No. PCT/US2020/053274
§ 371(c)(1), (2) Date Mar. 30, 2022,
PCT Pub. No. WO2021/067268, PCT Pub. Date Apr. 8, 2021.
Claims priority of provisional application 62/908,355, filed on Sep. 30, 2019.
Prior Publication US 2022/0384984 A1, Dec. 1, 2022
Int. Cl. H01R 13/518 (2006.01); H01R 13/6586 (2011.01); H01R 13/6589 (2011.01)
CPC H01R 13/518 (2013.01) [H01R 13/6586 (2013.01); H01R 13/6589 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A high density coupling panel, comprising:
a panel module having a plurality of channels;
a coupler inserted within each of the plurality of channels, wherein each coupler includes exactly one pair of electrical and data coupling contacts;
a metal panel that receives the panel module; and
a bonding strip that is electrically coupled to each coupler and to the metal panel;
wherein the plurality of channels are presented in an upper row and lower row configuration, the upper and lower rows of channels are separated by a spacer wall, and the spacer wall includes a projection that supports the bonding strip.