| CPC H01R 12/52 (2013.01) [H05K 1/111 (2013.01); H05K 3/3442 (2013.01); H05K 3/368 (2013.01); H01R 4/02 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 2201/042 (2013.01); H05K 2201/049 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10378 (2013.01); H10B 80/00 (2023.02)] | 20 Claims |

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1. An electronic module comprising:
a first wiring board;
a second wiring board disposed with a gap from the first wiring board in a first direction; and
an intermediate connection member interposed between the first wiring board and the second wiring board,
wherein the intermediate connection member includes:
an insulator;
a plurality of first wirings supported by the insulator and arranged at intervals in a second direction intersecting the first direction;
a plurality of second wirings supported by the insulator and arranged at intervals in the second direction; and
a metal layer supported by the insulator and interposed between the plurality of first wirings and the plurality of second wirings so as to oppose the plurality of first wirings and the plurality of second wirings in a third direction intersecting the first direction and the second direction, and
a part of the metal layer sandwiched in the insulator is bonded to one of the first wiring board or the second wiring board by a conductive first bonding member.
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