US 12,327,934 B2
Antenna and electronic device including the same
Sumin Yun, Suwon-si (KR); Hosaeng Kim, Suwon-si (KR); Seongjin Park, Suwon-si (KR); Woomin Jang, Suwon-si (KR); Jehun Jong, Suwon-si (KR); and Jaehoon Jo, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 21, 2024, as Appl. No. 18/612,494.
Application 18/612,494 is a continuation of application No. 17/584,981, filed on Jan. 26, 2022, granted, now 11,942,704, issued on Mar. 26, 2024.
Application 17/584,981 is a continuation of application No. PCT/KR2022/000638, filed on Jan. 13, 2022.
Claims priority of application No. 10-2021-0007832 (KR), filed on Jan. 20, 2021.
Prior Publication US 2024/0258699 A1, Aug. 1, 2024
Int. Cl. H01Q 1/24 (2006.01); H01Q 1/44 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 9/0421 (2013.01) [H01Q 1/44 (2013.01); H01Q 1/243 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing;
an antenna structure disposed in the housing and including:
a substrate including:
a first substrate surface facing toward a first direction, and
a ground layer,
at least one conductive patch disposed between the first substrate surface and the ground layer, and
at least one feeder disposed at a position of the at least one conductive patch;
an electronic component disposed in the housing over the first substrate surface and to overlap at least in part with the at least one conductive patch from a perspective above the electronic component in a second direction that is opposite to the first direction; and
a wireless communication circuit configured to at least one of transmit or receive a radio signal through the antenna structure,
wherein the electronic component is electrically connected to a printed circuit board (PCB), which is disposed in the housing, through at least one electrical connection structure.