US 12,327,826 B2
Semiconductor package
Yongkoon Lee, Suwon-si (KR); Myungsam Kang, Hwaseong-si (KR); and Youngchan Ko, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Apr. 15, 2022, as Appl. No. 17/721,745.
Claims priority of application No. 10-2021-0094047 (KR), filed on Jul. 19, 2021.
Prior Publication US 2023/0016061 A1, Jan. 19, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01)
CPC H01L 25/16 (2013.01) [H01L 23/053 (2013.01); H01L 23/3114 (2013.01); H01L 23/5383 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16157 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
an antenna structure having a first surface, a second surface opposite to the first surface, and a side surface between the first and second surfaces, and including a dielectric layer, an antenna member configured to transmit and receive a signal through the first surface in the dielectric layer, a connection via extending from the antenna member toward the second surface, and a ground member adjacent to the second surface in the dielectric layer, and spaced apart from the antenna member and the connection via;
a frame surrounding the side surface of the antenna structure;
a first encapsulant covering at least a portion of the antenna structure and the frame;
a redistribution structure on the second surface and including an insulating layer in contact with the antenna structure and the frame, and a redistribution conductor configured to be electrically connected to the ground member and the connection via in the insulating layer;
a first semiconductor chip on the redistribution structure and electrically connected to the antenna member through the redistribution conductor;
a second encapsulant encapsulating the first semiconductor chip on the redistribution structure; and
a shielding layer surrounding a surface of the second encapsulant.