US 12,327,820 B2
Thermal management of three-dimensional integrated circuits
Kambiz Vafai, Mission Viejo, CA (US); Andisheh Tavakoli, Irvine, CA (US); and Mohammad Reza Salimpour, Irvine, CA (US)
Assigned to Kambix Innovations, LLC, Albuquerque, NM (US)
Filed by KAMBIX INNOVATIONS, LLC, Albuquerque, NM (US)
Filed on Jun. 5, 2023, as Appl. No. 18/205,916.
Application 18/205,916 is a continuation of application No. 17/401,719, filed on Aug. 13, 2021, granted, now 11,710,723.
Claims priority of provisional application 63/229,842, filed on Aug. 5, 2021.
Prior Publication US 2023/0395570 A1, Dec. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/065 (2023.01); H01L 23/367 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A 3D integrated circuit device, comprising:
a substrate;
a thermal interface layer and at least one die;
at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die and wherein the at least one device layer comprises at least one electronic subsystem; and
a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.