US 12,327,810 B2
Die surface treatment apparatus and die bonding system including the same
Min Young Kim, Gyeonggi-do (KR); Hang Lim Lee, Chungcheongnam-do (KR); and Ji Hoon Park, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Apr. 21, 2022, as Appl. No. 17/726,487.
Prior Publication US 2023/0343740 A1, Oct. 26, 2023
Int. Cl. H01L 23/00 (2006.01); H05H 1/24 (2006.01)
CPC H01L 24/74 (2013.01) [H05H 1/24 (2013.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/80395 (2013.01); H05H 2245/40 (2021.05)] 18 Claims
OG exemplary drawing
 
1. A die surface treatment apparatus comprising:
a stage supporting dies;
a first plasma generator installed on a moving path of the dies, the first plasma generator performing a reduction process on surfaces of the dies, in a first plasma area;
a second plasma generator installed on the moving path of the dies, the second plasma generator performing a hydrophilization process on the surfaces of the dies, in a second plasma area; and
an integral electrode disposed in the first plasma generator and the second plasma generator, the integral electrode configured to simultaneously generate different types of plasmas in the first and second plasma areas, respectively,
wherein the stage rotates in at least one direction, and as the stage rotates, the dies sequentially pass through the first and second plasma areas.