US 12,327,795 B2
Waveguide interconnect bridges
Georgios Dogiamis, Chandler, AZ (US); and Johanna M. Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Nov. 22, 2022, as Appl. No. 17/992,771.
Application 17/992,771 is a division of application No. 15/963,066, filed on Apr. 25, 2018, granted, now 11,538,758.
Claims priority of application No. 20180100115 (GR), filed on Mar. 19, 2018.
Prior Publication US 2023/0088545 A1, Mar. 23, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2023.01); H01P 3/12 (2006.01); H01P 5/12 (2006.01)
CPC H01L 23/5381 (2013.01) [H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01P 3/12 (2013.01); H01P 3/121 (2013.01); H01P 5/12 (2013.01); H01L 2223/6627 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) structure, comprising:
a waveguide interconnect bridge, the waveguide interconnect bridge comprising a waveguide material and one or more wall cavities, the waveguide material laterally surrounding the one or more wall cavities, and the waveguide material having an uppermost surface at a same level as an uppermost surface of the one or more wall cavities; and
a package substrate;
wherein the waveguide interconnect bridge is in or on the package substrate.