US 12,327,794 B2
Die coupling using a substrate with a glass core
Telesphor Kamgaing, Chandler, AZ (US); and Johanna M. Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 17, 2021, as Appl. No. 17/350,152.
Prior Publication US 2022/0406721 A1, Dec. 22, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5381 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A package, comprising:
a die coupled with a first side of a substrate, the substrate with a second side opposite the first side, the substrate including a glass core;
the second side of the substrate coupled with an interposer; and
wherein the substrate electrically couples the first die with the interposer using one or more through glass structures through the glass core of the substrate.