US 12,327,780 B2
Semiconductor device including a lead and a sealing resin
Tomonori Tanioka, Kyoto (JP); and Kazuo Egami, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Jun. 2, 2022, as Appl. No. 17/831,143.
Claims priority of application No. 2021-107705 (JP), filed on Jun. 29, 2021.
Prior Publication US 2022/0415764 A1, Dec. 29, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49541 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 23/562 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/45124 (2013.01); H01L 2924/014 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a lead having a main surface facing in a thickness direction;
a semiconductor element mounted over the main surface; and
a sealing resin that is in contact with the main surface and covers the semiconductor element,
wherein the lead is formed with a plurality of grooves that are recessed from the main surface and are located apart from each other,
wherein the plurality of grooves are located away from a peripheral edge of the main surface,
wherein the plurality of grooves include a plurality of first grooves and a plurality of second grooves arranged along a first direction which is a direction orthogonal to the thickness direction,
wherein the plurality of first grooves and the plurality of second grooves are linear shapes extending orthogonally to the thickness direction,
wherein the plurality of second grooves are located next to the plurality of first grooves in a second direction orthogonal to the thickness direction and the first direction, and
wherein along the first direction, at least two of the plurality of first grooves and at least two of the plurality of second grooves are alternately arranged.