US 12,327,770 B2
Probe pad with built-in interconnect structure
Ashim Dutta, Clifton Park, NY (US); Ruturaj Nandkumar Pujari, Albany, NY (US); Saumya Sharma, Easton, CT (US); and Chih-Chao Yang, Glenmont, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Nov. 29, 2021, as Appl. No. 17/536,228.
Prior Publication US 2023/0170266 A1, Jun. 1, 2023
Int. Cl. H01L 21/66 (2006.01); G01B 11/27 (2006.01); G01R 1/073 (2006.01); H01L 23/544 (2006.01)
CPC H01L 22/32 (2013.01) [G01B 11/272 (2013.01); G01R 1/073 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a wafer including at least an electronic component; and
a probe pad including a built-in back-end-of-line (BEOL) interconnect structure to test the electronic component, the probe pad being aligned with the wafer by using a prober alignment camera between the probe pad and the wafer to locate alignment marks.