US 12,327,767 B2
Optical inspection apparatus in semiconductor process system
Shih-Yao Pan, Taoyuan (TW); and Hung-Tien Kao, Taoyuan (TW)
Assigned to CHROMA ATE INC., Taoyuan (TW)
Filed by CHROMA ATE INC., Taoyuan (TW)
Filed on Dec. 27, 2021, as Appl. No. 17/562,238.
Claims priority of application No. 109146974 (TW), filed on Dec. 30, 2020.
Prior Publication US 2022/0208618 A1, Jun. 30, 2022
Int. Cl. H01L 21/66 (2006.01); H04N 23/695 (2023.01)
CPC H01L 22/12 (2013.01) [H04N 23/695 (2023.01)] 12 Claims
OG exemplary drawing
 
1. An optical detection apparatus in a semiconductor manufacturing process, for defining a detection surface on a carrier unit for a wafer so as to obtain a corresponding detection image, a movement path in a vertical direction for another device to move being defined above the carrier unit, the optical detection apparatus comprising:
a support; and
an imaging device, disposed on the support and configured to be non-interfering with the movement path, the imaging device comprising:
a lens group, having an optical axis parallel to a normal line of the detection surface;
an image capturing portion, disposed behind the lens group to allow an image of the detection surface to be formed on a photosensitive element in the image capturing portion; and
a moving base, disposed between the lens group and the image capturing portion, the moving base having an adjustment sliding track, the adjustment sliding track allowing the photosensitive element of the image capturing portion to move in a horizontal direction relative to the lens group.