	US 12,327,754 B2
	Substrate transfer device including housing provided with fan
Kousei Ide, Kumamoto (JP); and Naruaki Iida, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Apr. 4, 2024, as Appl. No. 18/626,565.
Application 18/201,270 is a division of application No. 17/679,352, filed on Feb. 24, 2022, granted, now 11,705,359, issued on Jul. 6, 2023.
Application 18/626,565 is a continuation of application No. 18/201,270, filed on May 24, 2023, granted, now 11,978,655.
Claims priority of application No. 2021-029104 (JP), filed on Feb. 25, 2021; and application No. 2021-144921 (JP), filed on Sep. 6, 2021.
Prior Publication US 2024/0249968 A1, Jul. 25, 2024
Int. Cl. H01L 21/677 (2006.01); B65G 47/90 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)

CPC H01L 21/68707 (2013.01) [B65G 47/90 (2013.01); H01L 21/67178 (2013.01); H01L 21/67712 (2013.01)]

4 Claims

3. A substrate transfer device comprising:

a substrate holder configured to transfer a substrate to one of a plurality of processing modules that process the substrate;

a base provided to be connected to the substrate holder; and

a lift configured to move up and down the base,

wherein the lift includes a housing including a front space and a rear space that are partitioned by a partition plate in a front-rear direction,

the partition plate includes a hole formed at each of an upper end and a lower end of the rear space of the housing to communicate with the front space and the rear space,

and a fan is provided at a position corresponding to the hole;

wherein the plurality of processing modules include one processing module and another processing module that are transversely separated from each other, and

the lift is sandwiched between the one processing module and the another processing module,

wherein the front space of the housing is partitioned into a first space, a second space and a third space, and the hole is provided corresponding to the first to the third spaces.