US 12,327,751 B2
Massive parallel assembly method
Hans-Hermann Oppermann, Berlin (DE); Kai Zoschke, Berlin (DE); and Charles-Alix Manier, Berlin (DE)
Assigned to Fraunhofer-Gesellschaft zur FÖrderung der angewandten Forschung e.V., Munich (DE); and Huawei Technologies Duesseldorf GmbH, Duesseldorf (DE)
Filed by HUAWEI TECHNOLOGIES DUESSELDORF GMBH, Duesseldorf (DE); and FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V., Munich (DE)
Filed on Jun. 16, 2022, as Appl. No. 17/842,430.
Application 17/842,430 is a continuation of application No. PCT/EP2020/086335, filed on Dec. 16, 2020.
Claims priority of application No. 19216475 (EP), filed on Dec. 16, 2019.
Prior Publication US 2022/0319902 A1, Oct. 6, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 23/00 (2006.01); H10H 20/01 (2025.01)
CPC H01L 21/6836 (2013.01) [H01L 24/95 (2013.01); H10H 20/018 (2025.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/95136 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing a device, the method comprising:
providing a first carrier having attached thereto a plurality of chips by way of an adhesive layer disposed on the first carrier, wherein a first surface of the plurality of chips is attached to the first carrier;
selectively attaching a second surface of a subset of the plurality of chips to a conveyor carrier by way of a structured adhesive layer disposed on the conveyor layer;
selectively releasing the subset of the plurality of chips from the first carrier by way of debonding at corresponding sections of the adhesive layer of the first carrier to which the subset of the plurality of chips are attached;
attaching the first surface of the subset of the plurality of chips to a substrate of the device; and
releasing the subset of the plurality of chips from the conveyor carrier by way of debonding corresponding sections of the structured adhesive layer of the conveyor carrier to which the subset of the plurality of chips are attached,
wherein at least one of selectively releasing the subset of the plurality of chips from the first carrier and releasing the subset of the plurality of chips from the conveyor carrier is performed by way of laser debonding, and
wherein the first carrier and the conveyor carrier are glass carriers.