US 12,327,749 B2
Carrier chuck and methods of forming and using thereof
Deniz Turan, Chandler, AZ (US); Yosef Kornbluth, Phoenix, AZ (US); and Yonggang Li, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 21, 2022, as Appl. No. 17/949,258.
Prior Publication US 2024/0096678 A1, Mar. 21, 2024
Int. Cl. H01L 21/683 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67781 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A carrier chuck comprising:
a base plate with a top surface;
at least one electrode positioned in a first carrier region of the top surface and configured to be disposed proximally at a periphery of the base plate, wherein the at least one electrode is further configured to produce an electrostatic force at certain locations on a panel without device features to retain the panel placed on the carrier chuck during panel processing;
a dielectric layer positioned over the at least one electrode;
wherein the at least one electrode extends from the top surface of the base plate by a height of at least 20 μm to provide a first surface to engage the certain locations on the panel; and
a second carrier region of the top surface, wherein the second carrier region is configured with a second surface below the first surface for accommodating one or more device features on the panel.