US 12,327,744 B2
Substrate transfer device and substrate processing system
Tatsuo Hatano, Nirasaki (JP); Tetsuya Miyashita, Nirasaki (JP); Naoki Watanabe, Nirasaki (JP); and Naoyuki Suzuki, Fuchu (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/756,217
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Nov. 20, 2020, PCT No. PCT/JP2020/043457
§ 371(c)(1), (2) Date May 19, 2022,
PCT Pub. No. WO2021/106799, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 2019-217077 (JP), filed on Nov. 29, 2019.
Prior Publication US 2022/0415687 A1, Dec. 29, 2022
Int. Cl. H01L 21/677 (2006.01); B65G 54/02 (2006.01); H02K 41/03 (2006.01)
CPC H01L 21/67709 (2013.01) [B65G 54/02 (2013.01); H01L 21/67748 (2013.01); H02K 41/031 (2013.01); H02K 2201/18 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate transfer device, comprising:
a first planar motor installed in a first chamber and having an array of coils;
a second planar motor installed in a second chamber connected to the first chamber and having an array of coils;
at least two pairs of transfer units configured to move on at least one of the first planar motor and the second planar motor, configured to transfer a substrate, and including a first pair of transfer units and a second pair of transfer units; and
a controller configured to control supply of electric current to the coils of the first planar motor and the second planar motor so as to control positions, orientations, and magnetic levitation amounts of the at least two pairs of transfer units, and configured to execute a substrate transfer process,
wherein each pair of the at least two pairs of transfer units is configured to simultaneously support one substrate, and
wherein the substrate transfer process includes transferring the one substrate from the first pair to the second pair by adjusting the magnetic levitation amounts of the first pair and the second pair.