US 12,327,739 B2
Die bonding apparatus and manufacturing method for semiconductor apparatus
Hideharu Kobashi, Minami-Alps (JP); and Masayuki Mochizuki, Minami-Alps (JP)
Assigned to Fasford Technology Co., Ltd., Minami-Alps (JP)
Filed by Fasford Technology Co., Ltd., Minami-Alps (JP)
Filed on Dec. 10, 2021, as Appl. No. 17/643,610.
Claims priority of application No. 2020-211779 (JP), filed on Dec. 21, 2020.
Prior Publication US 2022/0199433 A1, Jun. 23, 2022
Int. Cl. H01L 21/67 (2006.01); G06T 7/00 (2017.01); G06T 7/73 (2017.01); H04N 23/56 (2023.01); H04N 23/90 (2023.01)
CPC H01L 21/67092 (2013.01) [G06T 7/001 (2013.01); G06T 7/74 (2017.01); H01L 21/67259 (2013.01); H04N 23/56 (2023.01); H04N 23/90 (2023.01); G06T 2207/30148 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A die bonding apparatus comprising:
an imaging device for photographing a wafer having dicing grooves surrounding a die;
an illumination device including a light emission section having a plane emission light source and a semi-transparent mirror for irradiating an upper surface of the die with an illumination light emitted from the light emission section so as to irradiate the die with the illumination light along an optical axis of the imaging device; and
a control device for controlling the imaging device and the illumination device,
wherein the illumination device is configured to adjust a light emitting surface size of the plane emission light source to limit an irradiation area of the light emission section in order to detect the dicing grooves by preventing light reflected from warpages formed in dice adjacent to the die from entering the image device, and
the control device is configured to:
irradiate an illumination light using the illumination device and at the same time detect the dicing grooves by photographing the wafer using the imaging device;
roughly determine a central position of the die by calculating a center coordinate of the die based on the detected dicing grooves;
move a center of the die to a center of the optical axis of the imaging device based on the center coordinate;
photograph again the moved die using the imaging device; and
determine a position determined by fine positioning for the central position by cutting out a search area of the die photographed again based on rough positioning and performing matching processing between the search area and a template specified in advance.