US 12,327,736 B2
Multilayer package substrate with improved current density distribution
Yiqi Tang, Allen, TX (US); Rajen Murugan, Dallas, TX (US); Phuong Minh Vu, Atlanta, GA (US); and Sylvester Ankamah-Kusi, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Apr. 30, 2022, as Appl. No. 17/733,998.
Prior Publication US 2023/0352314 A1, Nov. 2, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 21/485 (2013.01) [H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method comprising:
laying out at least two conductors;
modeling a conductor current through the at least two conductors to determine a current density in the at least two conductors;
marking the at least two conductors to form adjusted conductors by adding conductive material to areas of the conductor where the conductor current shows the current density is above a threshold;
fabricating the adjusted conductors;
mounting a die to the adjusted conductors; and
encapsulating the die and the adjusted conductors in an encapsulant.