US 12,327,728 B2
Method for manufacturing a pre-mold substrate
Jong Hoe Ku, Gyeongsangnam-do (KR); In Seob Bae, Gyeongsangnam-do (KR); and Kwang Jae Yoo, Gyeongsangnam-do (KR)
Assigned to HAESUNG DS CO., LTD., Gyeongsangnam-Do (KR)
Appl. No. 17/755,298
Filed by HAESUNG DS CO., LTD., Gyeongsangnam-do (KR)
PCT Filed Dec. 1, 2021, PCT No. PCT/KR2021/018021
§ 371(c)(1), (2) Date Apr. 26, 2022,
PCT Pub. No. WO2023/101044, PCT Pub. Date Jun. 8, 2023.
Claims priority of application No. 10-2021-0169331 (KR), filed on Nov. 30, 2021.
Prior Publication US 2024/0170291 A1, May 23, 2024
Int. Cl. H01L 21/304 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/3043 (2013.01) [H01L 24/29 (2013.01); H01L 2224/29021 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method of manufacturing a pre-mold substrate, the method comprising:
preparing an electrically conductive substrate;
forming a groove on one surface of the substrate;
arranging a resin to cover the one surface of the substrate and the groove;
removing a portion of the resin so that at least a portion of the one surface of the substrate protrudes higher than a surface of the resin covering the groove forming a mounting end, wherein the resin arranged in the groove is disposed so as to structurally form a portion of the pre-mold substrate with the mounting ends exposed; and
forming a circuit pattern on another surface of the substrate;
wherein the forming of the circuit pattern comprises arranging a photosensitive resist on the another surface of the substrate, exposing and developing a pattern mask corresponding to the circuit pattern facing the another surface of the substrate, and removing a portion of the another surface of the substrate by applying an etchant to the another surface of the substrate, and
wherein the forming of the circuit pattern further comprises forming a protective layer covering the one surface of the substrate, before applying the etchant to the another surface of the substrate, and removing the protective layer after applying the etchant to the another surface of the substrate.