US 12,327,671 B2
Coil component, circuit board, and electronic device
Hirotaka Wakabayashi, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Sep. 29, 2020, as Appl. No. 17/036,094.
Claims priority of application No. 2019-179237 (JP), filed on Sep. 30, 2019.
Prior Publication US 2021/0098186 A1, Apr. 1, 2021
Int. Cl. H01F 27/29 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01)
CPC H01F 27/29 (2013.01) [H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/0233 (2013.01); H01F 41/0246 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A coil component comprising:
a magnetic base body;
a conductor provided in the magnetic base body and wound around a coil axis; and
first and second external electrodes connected by metallic bond to at least parts of first and second end portions of the conductor, respectively,
wherein the first external electrode includes a first metal film connected outside of the magnetic base body to the first end portion and the second external electrode includes a second metal film connected outside of the magnetic base body to the second end portion,
wherein the first and second metal films each include metal particles, and
wherein a density of the metal particles with respect to a total of the metal particles and voids in each of the first and second metal films is 99% or larger.