	US 12,327,670 B2
	Apparatus for an inductor disposed in a band for method of heat dispersion
Dhammika L. Perera, San Jose, CA (US); John Weld, Ledgewood, NJ (US); and Matthew Wilkowski, Rockwell, TX (US)
Assigned to Modular Power Technology, Inc., Sunnyvale, CA (US)
Filed by Modular Power Technology, Inc., Sunnyvale, CA (US)
Filed on Aug. 31, 2023, as Appl. No. 18/459,127.
Application 18/459,127 is a continuation of application No. 17/687,381, filed on Mar. 4, 2022, granted, now 11,770,916.
Application 17/687,381 is a continuation of application No. 17/495,190, filed on Oct. 6, 2021, granted, now 11,317,545, issued on Apr. 26, 2022.
Claims priority of provisional application 63/105,567, filed on Oct. 26, 2020.
Prior Publication US 2024/0023291 A1, Jan. 18, 2024
Int. Cl. H01F 27/22 (2006.01); H01F 1/147 (2006.01); H01F 1/34 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H02M 1/00 (2006.01); H05K 7/12 (2006.01); H05K 7/20 (2006.01); H10D 89/60 (2025.01)

CPC H01F 27/22 (2013.01) [H01F 1/147 (2013.01); H01F 1/344 (2013.01); H01F 27/24 (2013.01); H01F 27/2876 (2013.01); H02M 1/0003 (2021.05); H05K 7/12 (2013.01); H05K 7/209 (2013.01); H10D 89/60 (2025.01); H05K 2201/1003 (2013.01)]

20 Claims

1. A method comprising:

providing an inductor comprising a top magnetic core and a bottom magnetic core, wherein the top magnetic core includes a first opening formed in a bottom side of the top magnetic core and the bottom magnetic core includes a second opening formed in an edge side of the bottom magnetic core, and wherein the first opening and the second opening is for coupling the top magnetic core and the bottom magnetic core to one or more internal conductors; and

disposing a thermally conductive band on a surface of the inductor, the thermally conductive band configured to be in thermal convective contact with one or more electrical components of a substrate based on the thermally conductive band being elevated over the one or more electrical components by at least a thickness of a thermal interface.